Microelectronic package
Hermetic packages for microelectronics are used for the encapsulation of hybrid or integrated circuits that require long-term protection against moisture and atmospheric contamination.
Typically manufactured from Kovar® to match the thermal expansion of glass or ceramics, these packages are produced according to customer drawings and specifications.
They can include standard bases or custom geometries, offering multiple pin configurations and plating options.
Designed for professional, military, space, and naval applications, they ensure mechanical strength, electrical integrity, and vacuum-tight sealing under the most demanding environments
